United Technologies Corporation Senior Engineering Manager - Microelectronics and Packaging in Cedar Rapids, Iowa

Job ID: 13877

City: Cedar Rapids

State: Iowa

Country: United States

Category: Engineering

Job Type:


Requisition ID: 13877

Want to work with some of the most talented, dedicated people on the planet? Do you value relationships, commitment, innovation and integrity? Want to be a part of a company that has been named numerous times as America’s Best Employer in Aerospace and Defense by Forbes magazine?

Then Rockwell Collins is the place for you. Join our team and build a rewarding career while helping to deliver the most trusted source of aviation and high-integrity solutions in the world.

We are currently searching for a Senior Engineering Manager - Microelectronics and Packaging to join our team in Cedar Rapids, IA (1000). A comprehensive relocation package is available for qualified candidates. Employing some of the most talented, dedicated people on the planet is not by chance. People from all over the globe choose Rockwell Collins as the place to build a rewarding career, while helping create and deliver communications, integration, and engineering solutions that our global customers demand so that our world keeps moving and stays connected. It’s an exciting time to become a part of our team. Join us and discover how high your career can soar at Rockwell Collins.

Job Summary

Rockwell Collins Government Systems (GS) Communication Engineering Organization is currently seeking candidates with the technical and leadership skills for a Senior Engineering Manager position for the GS Microelectronics and Packaging Design group. The position will support the microelectronics packaging, advanced interconnect, and printed electronics technology activities throughout Rockwell Collins.

Job Responsibilities

This Senior Engineering Manager will work throughout the Rockwell Collins enterprise to lead a team of mechanical, material science, and chemical engineers that support a wide array of products throughout Government Systems and Rockwell Collins. This person will be responsible for the successful program execution and development of the microelectronics packaging, advanced interconnect, and printed electronics solutions necessary to meet current and future requirements. This person should ensure that quality, technical requirements, cost, and schedule goals are met. This includes Requirements Capture, Design, Integration, Test, Qualification and Factory Transition. This manager will be responsible for helping to define yearly technology roadmap development and discretionary planning and support of Program Management and Business Development in pursuit of new opportunities as well as providing support to our existing customers. Candidate will also be responsible for providing leadership, guidance, hiring and support the training of new engineers and keeping training plans up to date.

In addition to mechanical engineering related activities this individual must be able and willing to perform the following functions:

  • Strong leadership skills and the ability to manage resources to support many simultaneous projects.

  • Make assignments for the team members that benefit both the performance goals of the project (short-term) and the interests and career development goals of the individual team member (long-term). The candidate must be both an advocate of the team members and a good steward for the projects, and have the ability to balance these two objectives.

  • Provide the team members with technical mentorship by helping them with both short-term and long-term career development support.

  • Build trust and have open communication with employees.

  • Give direct and meaningful feedback in real-time and in a constructive manner.

  • Take action when performance does not match expected standard.

  • Be an advocate for resources (equipment, training, etc.) for employees.

  • Build and leverage personal networks for connecting team members to resources needed to get their assignment complete as well as using the network to help the team members meet their long-term career goals.

  • Assess long-term staffing needs and acquire talent to meet those needs.

  • Travel occasionally to meet with various customers or vendors.

Basic Qualifications

  • Bachelor of Science degree in Mechanical Engineering or related engineering field and at least 8 years of applicable engineering experience.

  • Candidate must be a U.S. citizen and be able to obtain a U.S. DoD Secret Security Clearance.

  • A solid foundation in the mechanical engineering process, experience with microelectronics fabrication and packaging, reliability, producibility and demonstrated knowledge of project planning and execution to an established schedule are required.

The ideal candidate must have the following demonstrated skills:

  • Microelectronics design and manufacturing assembly, packaging materials and material properties

  • Electronic component reliability testing and failure analysis techniques

  • Knowledge of project planning, setting up project schedules, identifying staff to execute the project, and ensuring that the team executes to the established schedule

  • Excellent written and verbal communication skills that can be used to support bid and proposal activities, along with having the ability to interface with both internal and external customers, program management and senior management across all business areas within Government Systems.

  • Work closely with the project leads, various functional discipline leads, and program management to ensure that commitments are met.

At Rockwell Collins, we believe a solid work-life balance creates a healthy lifestyle and inspires creativity and innovation. We value our people and invest in their development, growth and success at our company by providing development opportunities through Rockwell Collins University, networking, mentoring, and tuition reimbursement.

And that’s just for starters.

Some of our competitive benefits package includes:

  • Medical, dental, and vision insurance

  • Three weeks of vacation for newly hired employees

  • Company-paid winter holiday shutdown for most locations

  • Generous 401(k) plan that matches 62.5 percent of the first 8 percent of eligible compensation you contribute (or 5 percent if you save 8 percent)

  • An Incentive Pay Plan based upon company performance

  • Tuition reimbursement

  • And more

Interested yet? Apply now and embark on your next worthwhile adventure!

Rockwell Collins is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, gender, sexual orientation, gender identity, disability, protected veteran status or any other protected status.


Thank you for your interest in a career at United Technologies! We will soon upgrade to an improved job application system to simplify the apply experience. You will still be able to apply to any of our current job openings through December 18, 2018. On January 2, 2019, our new and improved job application system will launch; please check back on that date to see all of our job openings.