United Technologies Corporation Staff Research Engineer, Power Electronics Packaging in East Hartford, Connecticut

Job ID: 66962BR

City: East Hartford

State: Connecticut

Country: United States

Category: Engineering

Job Type: Full Time

Description:

The Power Electronics Systems group within the United Technologies Research Center (UTRC) has an exciting employment opportunity for a Staff Research Engineer, Power Electronics Packaging. This is an experienced professional technical position within the UTRC organization, reporting directly to the Group Leader, Power Electronics Systems.

UTRC is the central research organization of United Technologies Corporation (UTC) which ensures the corporation’s technological advantage in the market and solves the toughest scientific challenges for our business unit customers. The Power Electronics Systems group, part of the Systems Department, matures and transitions power electronics and electric machines technologies that improve product performance, robustness, efficiency and cost. Power and energy systems are at the core of many automation, transportation, manufacturing, and building applications. We believe that the future of these applications will be fundamentally changed by power electronics systems technologies. Do you want to be part of the challenge?

As a Staff Research Engineer, Power Electronics Packaging you will be responsible for supporting and driving the execution of research projects targeting commercial/industrial or aerospace applications, working as (or with) a Principal Investigator, and under the guidance of a Project Leader. Specific responsibilities may include, but are not limited to:

  • Own and execute WBS items within UTRC technology programs and initiatives with minimum supervision; own WBS item scope, cost and schedule.

  • Define and assign tasks, and provide direction to junior-level engineering and support staff.

  • Execute strategy for engagement with business unit customers.

  • Expand collaboration network; actively engage as an alumni or member of external organization.

  • Contribute to the expansion of the team’s capability on technologies that enable next-generation commercial and aerospace applications.

  • Execute strategy for growing internal and external funding stream.

  • Support BU product development (TRL5-6) as part of technology transfer.

  • Provide technical expertise to the business units as required.

  • Participate in corporate-led advanced technology projects.

The successful candidate must be able to work effectively in a multidisciplinary, multinational team environment focused on innovation. The candidate may interact with internal and external customers and leadership team members.

Qualification:

UTRC is looking for an outstanding individual with power assembly (device, module and PCB) packaging background that can relate knowledge to higher assemblies in the design hierarchy (i.e., converters and systems) to help advance power electronics technology in several of the following key areas:

  • High power density converters (in the 1-1000 kW range).

  • High frequency converters (up to 1 MHz).

  • High voltage converters (up to 10 kV).

  • Harsh-environment electronics (e.g., extreme temperatures, high-altitude, cosmic radiation, etc.).

  • Multi-physics approach to modeling and simulation.

  • EMI/EMC optimization of converters and sub-assemblies, with emphasis on system-level impact.

  • Highly-integrated electromechanical systems

Qualified applicants should have a background that fits one of the following profiles:

  • Power electronics academic background plus experience with mechanical/thermal design (preferred).

  • Mechanical/thermal academic background plus experience with power electronics design.

Industry experience in power electronics is required, with exposure to the entire product development life cycle (could be as part of a corporate research or advanced engineering group). Familiarity with both ECAD and MCAD tools is required. Basic project management skills are required. The candidate will need to have good communication skills, capable of interacting with UTRC management and internal/external customers, and the ability to provide timely, accurate and detailed reports and presentations. The candidate must have a relevant portfolio of peer-reviewed and refereed publications in the field of power electronics. The job requires peer recognized achievement in the area of power electronics electro-mechanical design. A specific list of publications with title, date and forum must be submitted.

Ideal candidate skills should align with several of the following:

  • Experience with solid modeling and prototyping using tools such as SolidWorks, Ansys, COMSOL, STAR-CCM+, etc.

  • Experience packaging electronic components and sub-assemblies to meet power, mechanical, thermal, shock, vibration, size, weight and electrical isolation requirements.

  • Design knowledge of cooling methods for components and sub-assemblies, including thermal interface materials.

  • Mechanical component and material selection for enclosures and electronics packaging (e.g., connectors, bus bars, termination blocks, shielding, interconnects, etc.)

  • Ability to perform stress, fatigue, thermal, and tolerance stack-up analyses.

  • Understanding of traditional machine shop fabrication.

  • Understanding of production processes for manufacturing and assembly of electronic components, PCBs and products.

  • Understanding of power device / module fabrication methods, material sets and advanced packaging technologies.

  • Understanding of materials used for wide temperature packaging (-55C to 200C+) in the areas of low voltage analog and digital circuits, power components and passives.

  • Experience with 2D / 3D component layout of PCBs. High proficiency in multi-layer board designs.

  • Knowledge in design of ceramic hybrid circuits.

  • Experience with high-frequency (MHz) component layout and design, including electromagnetic (EM) simulation.

  • Ability to perform electrostatic field analysis for high voltage designs and understanding of spacing rules and guidelines.

Following qualifications are not required, but are highly desirable:

  • Multi-disciplinary academic background combining electrical, thermal, mechanical and controls elements relevant to power electronics.

  • Experience with aerospace or commercial/industrial applications of power electronics.

  • Exposure to novel manufacturing techniques (e.g., additive).

  • Design-related understanding of DO-160, MIL-STD-704, MIL-STD-461 qualification standards.

Education: Minimum: M.S. in Electrical or Mechanical Engineering with at least 10 years of relevant research or industry experience.

Preferred: Ph.D. in Electrical or Mechanical Engineering with at least 5 years of relevant research or industry experience.

United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

Qualification:

UTRC is looking for an outstanding individual with power assembly (device, module and PCB) packaging background that can relate knowledge to higher assemblies in the design hierarchy (i.e., converters and systems) to help advance power electronics technology in several of the following key areas:

  • High power density converters (in the 1-1000 kW range).

  • High frequency converters (up to 1 MHz).

  • High voltage converters (up to 10 kV).

  • Harsh-environment electronics (e.g., extreme temperatures, high-altitude, cosmic radiation, etc.).

  • Multi-physics approach to modeling and simulation.

  • EMI/EMC optimization of converters and sub-assemblies, with emphasis on system-level impact.

  • Highly-integrated electromechanical systems

Qualified applicants should have a background that fits one of the following profiles:

  • Power electronics academic background plus experience with mechanical/thermal design (preferred).

  • Mechanical/thermal academic background plus experience with power electronics design.

Industry experience in power electronics is required, with exposure to the entire product development life cycle (could be as part of a corporate research or advanced engineering group). Familiarity with both ECAD and MCAD tools is required. Basic project management skills are required. The candidate will need to have good communication skills, capable of interacting with UTRC management and internal/external customers, and the ability to provide timely, accurate and detailed reports and presentations. The candidate must have a relevant portfolio of peer-reviewed and refereed publications in the field of power electronics. The job requires peer recognized achievement in the area of power electronics electro-mechanical design. A specific list of publications with title, date and forum must be submitted.

Ideal candidate skills should align with several of the following:

  • Experience with solid modeling and prototyping using tools such as SolidWorks, Ansys, COMSOL, STAR-CCM+, etc.

  • Experience packaging electronic components and sub-assemblies to meet power, mechanical, thermal, shock, vibration, size, weight and electrical isolation requirements.

  • Design knowledge of cooling methods for components and sub-assemblies, including thermal interface materials.

  • Mechanical component and material selection for enclosures and electronics packaging (e.g., connectors, bus bars, termination blocks, shielding, interconnects, etc.)

  • Ability to perform stress, fatigue, thermal, and tolerance stack-up analyses.

  • Understanding of traditional machine shop fabrication.

  • Understanding of production processes for manufacturing and assembly of electronic components, PCBs and products.

  • Understanding of power device / module fabrication methods, material sets and advanced packaging technologies.

  • Understanding of materials used for wide temperature packaging (-55C to 200C+) in the areas of low voltage analog and digital circuits, power components and passives.

  • Experience with 2D / 3D component layout of PCBs. High proficiency in multi-layer board designs.

  • Knowledge in design of ceramic hybrid circuits.

  • Experience with high-frequency (MHz) component layout and design, including electromagnetic (EM) simulation.

  • Ability to perform electrostatic field analysis for high voltage designs and understanding of spacing rules and guidelines.

Following qualifications are not required, but are highly desirable:

  • Multi-disciplinary academic background combining electrical, thermal, mechanical and controls elements relevant to power electronics.

  • Experience with aerospace or commercial/industrial applications of power electronics.

  • Exposure to novel manufacturing techniques (e.g., additive).

  • Design-related understanding of DO-160, MIL-STD-704, MIL-STD-461 qualification standards.

United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.